• TC277TP64F200NDCKXUMA3 Temperature Sensor Chip IC MCU 32BIT 4MB 292LFBGA
TC277TP64F200NDCKXUMA3 Temperature Sensor Chip IC MCU 32BIT 4MB 292LFBGA

TC277TP64F200NDCKXUMA3 Temperature Sensor Chip IC MCU 32BIT 4MB 292LFBGA

Product Details:

Place of Origin: original
Brand Name: original
Certification: original
Model Number: TC277TP64F200NDCKXUMA3

Payment & Shipping Terms:

Minimum Order Quantity: 1
Price: negotiation
Packaging Details: carton box
Delivery Time: 1-3working days
Payment Terms: T/T, L/C
Supply Ability: 100,000
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Detail Information

Product Status: Active Core Processor: TriCore™
Core Size: 32-Bit Tri-Core Speed: 200MHz
Program Memory Type: FLASH Peripherals: DMA, POR, WDT
Number Of I/O: 169 Program Memory Size: 4MB (4M X 8)
High Light:

TC277TP64F200NDCKXUMA3

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IC MCU 32BIT 4MB 292LFBGA

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Temperature Sensor Chip IC MCU

Product Description

TC277TP64F200NDCKXUMA3 Integrated Circuits IC Mcu 32bit 4mb Flash 292lfbga

 

TriCore™ AURIX™ Microcontroller IC 32-Bit Tri-Core 200MHz 4MB (4M x 8) FLASH PG-LFBGA-292-6

 

Specifications of  MIC5841YWM

 

TYPE DESCRIPTION
Category Integrated Circuits (ICs)
Embedded
Microcontrollers
Mfr Infineon Technologies
Series AURIX™
Package Tape & Reel (TR)
Cut Tape (CT)
Digi-Reel®
Product Status Active
Core Processor TriCore™
Core Size 32-Bit Tri-Core
Speed 200MHz
Connectivity ASC, CANbus, Ethernet, FlexRay, HSSL, I²C, LINbus, MSC, PSI5, QSPI, SENT
Peripherals DMA, POR, WDT
Number of I/O 169
Program Memory Size 4MB (4M x 8)
Program Memory Type FLASH
EEPROM Size 64K x 8
RAM Size 472K x 8
Voltage - Supply (Vcc/Vdd) 1.17V ~ 5.5V
Data Converters A/D 60x12b SAR, Sigma-Delta
Oscillator Type External
Operating Temperature -40°C ~ 125°C (TA)
Mounting Type Surface Mount
Package / Case 292-LFBGA
Supplier Device Package PG-LFBGA-292-6
Base Product Number TC277TP64

 

Features of MIC5841YWM

 
The TC27x product family has the following features:
• High Performance Microcontroller with three CPU cores
• Two 32-bit super-scalar TriCore CPUs (TC1.6P), each having the following features:
– Superior real-time performance
– Strong bit handling
– Fully integrated DSP capabilities
– Multiply-accumulate unit able to sustain 2 MAC operations per cycle
– Fully pipelined Floating point unit (FPU)
– up to 200 MHz operation at full temperature range
– up to 120 Kbyte Data Scratch-Pad RAM (DSPR)
– up to 32 Kbyte Instruction Scratch-Pad RAM (PSPR)
– 16 Kbyte Instruction Cache (ICACHE)
– 8 Kbyte Data Cache (DCACHE)
• Power Efficient scalar TriCore CPU (TC1.6E), having the following features:
– Binary code compatibility with TC1.6P
– up to 200 MHz operation at full temperature range
– up to 112 Kbyte Data Scratch-Pad RAM (DSPR)
– up to 24 Kbyte Instruction Scratch-Pad RAM (PSPR)
– 8 Kbyte Instruction Cache (ICACHE)
– 0.125Kbyte Data Read Buffer (DRB)
• Lockstepped shadow cores for one TC1.6P and for TC1.6E
• Multiple on-chip memories
– All embedded NVM and SRAM are ECC protected
– up to 4 Mbyte Program Flash Memory (PFLASH)
– up to 384 Kbyte Data Flash Memory (DFLASH) usable for EEPROM emulation
– 32 Kbyte Memory (LMU)
– BootROM (BROM)
• 64-Channel DMA Controller with safe data transfer
• Sophisticated interrupt system (ECC protected)
• High performance on-chip bus structure
– 64-bit Cross Bar Interconnect (SRI) giving fast parallel access between bus masters, CPUs and memories
– 32-bit System Peripheral Bus (SPB) for on-chip peripheral and functional units
– One bus bridge (SFI Bridge)
• Optional Hardware Security Module (HSM) on some variants
• Safety Management Unit (SMU) handling safety monitor alarms
• Memory Test Unit with ECC, Memory Initialization and MBIST functions (MTU)
• Hardware I/O Monitor (IOM) for checking of digital I/O
• Versatile On-chip Peripheral Units
– Four Asynchronous/Synchronous Serial Channels (ASCLIN) with hardware LIN support (V1.3, V2.0, V2.1 and J2602) up to 50 MBaud

 

APPLICATIONS of MIC5841YWM

 

• LVDSM output pads,LVDSH input pad, master mode, CL=25pF
• Medium Performance Plus Pads (MP+):
– strong sharp edge (MP+ss), CL=25pF
– strong medium edge (MP+sm), CL=50pF
– medium edge (MP+m), CL=50pF
– weak edge (MP+w), CL=50pF
• Medium Performance Pads (MP):
– strong sharp edge (MPss), CL=25pF
– strong medium edge (MPsm), CL=50pF
• Medium and Low Performance Pads (MP/LP), the identical output strength settings:
– medium edge (LP/MPm), CL=50pF
– weak edge (MPw), CL=50pF
 

Environmental & Export Classifications of MIC5841YWM

 
ATTRIBUTE DESCRIPTION
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A991A2
HTSUS 8542.31.0001

 

TC277TP64F200NDCKXUMA3 Temperature Sensor Chip IC MCU 32BIT 4MB 292LFBGA 0



 

 

 

 

 

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