• S29WS256P0PBFW000 Temperature Sensor Chip Ic Flash 256mbit Parallel 84fbga
S29WS256P0PBFW000 Temperature Sensor Chip Ic Flash 256mbit Parallel 84fbga

S29WS256P0PBFW000 Temperature Sensor Chip Ic Flash 256mbit Parallel 84fbga

Product Details:

Place of Origin: original
Brand Name: original
Certification: original
Model Number: S29WS256P0PBFW000

Payment & Shipping Terms:

Minimum Order Quantity: 1
Price: negotiation
Packaging Details: carton box
Delivery Time: 1-3working days
Payment Terms: T/T, L/C
Supply Ability: 100,000
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Detail Information

Memory Type: Non-Volatile Memory Format: FLASH
Technology: FLASH - NOR Memory Size: 256Mbit
Memory Organization: 16M X 16 Memory Interface: Parallel
Clock Frequency: 66 MHz Write Cycle Time - Word, Page: 60ns

Product Description

S29WS256P0PBFW000 Temperature Sensor Chip Ic Flash 256mbit Parallel 84fbga

 

FLASH - NOR Memory IC 256Mbit Parallel 66 MHz 80 ns 84-FBGA (11.6x8)

 

Specifications of  S29WS256P0PBFW000

 

TYPE DESCRIPTION
Category Integrated Circuits (ICs)
Memory
Memory
Mfr Infineon Technologies
Series WS-P
Package Tray
Product Status Discontinued at Digi-Key
Memory Type Non-Volatile
Memory Format FLASH
Technology FLASH - NOR
Memory Size 256Mbit
Memory Organization 16M x 16
Memory Interface Parallel
Clock Frequency 66 MHz
Write Cycle Time - Word, Page 60ns
Access Time 80 ns
Voltage - Supply 1.7V ~ 1.95V
Operating Temperature -25°C ~ 85°C (TA)
Mounting Type Surface Mount
Package / Case 84-VFBGA
Supplier Device Package 84-FBGA (11.6x8)
Base Product Number S29WS256

 

Features of S29WS256P0PBFW000

 
• Single 1.8 V read/program/erase (1.70–1.95 V)
• 90 nm MirrorBit™ Technology
• Simultaneous Read/Write operation with zero latency
• Random page read access mode of 8 words with 20ns intra page access time
• 32 Word / 64 Byte Write Buffer
• Sixteen-bank architecture consisting of 32/16/8 Mwords for 512/256/128P, respectively
• Four 16 Kword sectors at both top and bottom of memory array
• 510/254/126 64Kword sectors (WS512/256/128P)
• Programmable linear (8/16/32) with or without wrap around and continuous burst read modes
• Secured Silicon Sector region consisting of 128 words each for factory and 128 words for customer
• 20-year data retention (typical)
• Cycling Endurance: 100,000 cycles per sector(typical)
• Command set compatible with JEDEC (42.4) standard
• Hardware (WP#) protection of top and bottom sectors
• Dual boot sector configuration (top and bottom)
• Handshaking by monitoring RDY
• Offered Packages
– WS512P/WS256P/WS128P: 84-ball FBGA (11.6 mm x 8 mm)
• Low VCC write inhibit
• Persistent and Password methods of Advanced Sector Protection
• Write operation status bits indicate program and erase operation completion
• Suspend and Resume commands for Program and Erase operations
• Unlock Bypass program command to reduce programming time
• Synchronous or Asynchronous program operation, independent of burst control register settings
• ACC input pin to reduce factory programming time
• Support for Common Flash Interface (CFI)

 

 

Applications of S29WS256P0PBFW000

 

• Using the Operation Status Bits in AMD Devices
• Understanding Burst Mode Flash Memory Devices
• Simultaneous Read/Write vs. Erase Suspend/Resume
• MirrorBit® Flash Memory Write Buffer Programming and Page Buffer Read
• Design-In Scalable Wireless Solutions with Cypress Products
• Common Flash Interface Version 1.4 Vendor Specific Extensions
 

Environmental & Export Classifications of S29WS256P0PBFW000

 
ATTRIBUTE DESCRIPTION
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A991B1A
HTSUS 8542.32.0071
 

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