• IRF6713STRPBF N-Channel 25 V 22A (Ta), 95A (Tc) 2.2W (Ta), 42W (Tc)
IRF6713STRPBF N-Channel 25 V 22A (Ta), 95A (Tc) 2.2W (Ta), 42W (Tc)

IRF6713STRPBF N-Channel 25 V 22A (Ta), 95A (Tc) 2.2W (Ta), 42W (Tc)

Product Details:

Place of Origin: original
Brand Name: original
Certification: original
Model Number: IRF6713STRPBF

Payment & Shipping Terms:

Minimum Order Quantity: 1
Price: negotiation
Packaging Details: carton box
Delivery Time: 1-3working days
Payment Terms: T/T
Supply Ability: 100,000
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Detail Information

Technology: MOSFET (Metal Oxide) Rds On (Max) @ Id, Vgs: 3mOhm @ 22A, 10V
Drain To Source Voltage (Vdss): 25 V Current - Continuous Drain (Id) @ 25°C: 22A (Ta), 95A (Tc)
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V Gate Charge (Qg) (Max) @ Vgs: 32 NC @ 4.5 V
Vgs(th) (Max) @ Id: 2.4V @ 50µA Input Capacitance (Ciss) (Max) @ Vds: 2880 PF @ 13 V

Product Description

IRF6713STRPBF N-Channel 25 V 22A (Ta), 95A (Tc) 2.2W (Ta), 42W (Tc)
 
Specifications of IRF6713STRPBF

 

TYPE DESCRIPTION
Category Discrete Semiconductor Products
  Transistors
  FETs, MOSFETs
  Single FETs, MOSFETs
Mfr Infineon Technologies
Series HEXFET®
Package Tape & Reel (TR)
FET Type N-Channel
Technology MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss) 25 V
Current - Continuous Drain (Id) @ 25°C 22A (Ta), 95A (Tc)
Drive Voltage (Max Rds On, Min Rds On) 4.5V, 10V
Rds On (Max) @ Id, Vgs 3mOhm @ 22A, 10V
Vgs(th) (Max) @ Id 2.4V @ 50µA
Gate Charge (Qg) (Max) @ Vgs 32 nC @ 4.5 V
Vgs (Max) ±20V
Input Capacitance (Ciss) (Max) @ Vds 2880 pF @ 13 V
FET Feature -
Power Dissipation (Max) 2.2W (Ta), 42W (Tc)
Operating Temperature -40°C ~ 150°C (TJ)
Mounting Type Surface Mount
Supplier Device Package DIRECTFET™ SQ
Package / Case DirectFET™ Isometric SQ

 

Features of IRF6713STRPBF


 RoHS Compliant Containing No Lead and Bromide 
 Low Profile (<0.7 mm)
 Dual Sided Cooling Compatible 
 Ultra Low Package Inductance
 Optimized for High Frequency Switching 
 Ideal for CPU Core DC-DC Converters
 Optimized for both Sync.FET and some Control FET application
 Low Conduction and Switching Losses
 Compatible with existing Surface Mount Techniques 
 100% Rg tested

 

 

Descriptions of IRF6713STRPBF


The IRF6713SPbF combines the latest HEXFET® Power MOSFET Silicon technology with the advanced DirectFETTM packaging to achieve the lowest on-state resistance in a package that has the footprint of a MICRO-8 and only 0.7 mm profile. The DirectFET package is compatible with existing layout geometries used in power applications, PCB assembly equipment and vapor phase, infra-red or convection soldering techniques, when application note AN-1035 is followed regarding the manufacturing methods and processes. The DirectFET package allows dual sided cooling to maximize thermal transfer in power systems, improving previous best thermal resistance by 80%.

 


Environmental & Export Classifications of IRF6713STRPBF

 

ATTRIBUTE DESCRIPTION
Moisture Sensitivity Level (MSL) 1 (Unlimited)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8541.29.0095

 
IRF6713STRPBF N-Channel 25 V 22A (Ta), 95A (Tc) 2.2W (Ta), 42W (Tc) 0
 

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