LCMXO2-1200HC-5TG100C General Purpose Relays Ic Fpga 79 I/O 100tqfp
Product Details:
Place of Origin: | original |
Brand Name: | original |
Certification: | original |
Model Number: | LCMXO2-1200HC-5TG100C |
Payment & Shipping Terms:
Minimum Order Quantity: | 1 |
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Price: | negotiation |
Packaging Details: | carton box |
Delivery Time: | 1-3working days |
Payment Terms: | T/T, L/C |
Supply Ability: | 100,000 |
Detail Information |
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Series: | MachXO2 | Package: | Tray |
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Product Status: | Active | Digi-Key Programmable: | Not Verified |
Number Of LABs/CLBs: | 160 | Number Of Logic Elements/Cells: | 1280 |
Total RAM Bits: | 65536 | Number Of I/O: | 79 |
Product Description
MachXO2 Field Programmable Gate Array (FPGA) IC 79 65536 1280 100-LQFP
Specifications of LCMXO2-1200HC-5TG100C
TYPE | DESCRIPTION |
Category | Integrated Circuits (ICs) |
Embedded | |
FPGAs (Field Programmable Gate Array) | |
Mfr | Lattice Semiconductor Corporation |
Series | MachXO2 |
Package | Tray |
Product Status | Active |
Digi-Key Programmable | Not Verified |
Number of LABs/CLBs | 160 |
Number of Logic Elements/Cells | 1280 |
Total RAM Bits | 65536 |
Number of I/O | 79 |
Voltage - Supply | 2.375V ~ 3.465V |
Mounting Type | Surface Mount |
Operating Temperature | 0°C ~ 85°C (TJ) |
Package / Case | 100-LQFP |
Supplier Device Package | 100-TQFP (14x14) |
Base Product Number | LCMXO2-1200 |
Features of LCMXO2-1200HC-5TG100C
• Six devices with 256 to 6864 LUT4s and 18 to 334 I/Os
Ultra Low Power Devices
• Advanced 65 nm low power process
• As low as 22 µW standby power
• Programmable low swing differential I/Os
• Stand-by mode and other power saving options
Embedded and Distributed Memory
• Up to 240 kbits sysMEM™ Embedded Block RAM
• Up to 54 kbits Distributed RAM
• Dedicated FIFO control logic
On-Chip User Flash Memory
• Up to 256 kbits of User Flash Memory
• 100,000 write cycles
• Accessible through WISHBONE, SPI, I2 C and JTAG interfaces
• Can be used as soft processor PROM or as Flash memory
Pre-Engineered Source Synchronous I/O
• DDR registers in I/O cells
• Dedicated gearing logic
• 7:1 Gearing for Display I/Os
• Generic DDR, DDRX2, DDRX4
• Dedicated DDR/DDR2/LPDDR memory with DQS support
High Performance, Flexible I/O Buffer
• Programmable sysIO™ buffer supports wide range of interfaces:
– LVCMOS 3.3/2.5/1.8/1.5/1.2
– LVTTL
– PCI
– LVDS, Bus-LVDS, MLVDS, RSDS, LVPECL
– SSTL 25/18
– HSTL 18
– Schmitt trigger inputs, up to 0.5 V hysteresis
• I/Os support hot socketing
• On-chip differential termination
• Programmable pull-up or pull-down mode
Flexible On-Chip Clocking
• Eight primary clocks
• Up to two edge clocks for high-speed I/O interfaces (top and bottom sides only)
• Up to two analog PLLs per device with fractional-n frequency synthesis
– Wide input frequency range (7 MHz to 400 MHz)
Non-volatile, Infinitely Reconfigurable
• Instant-on – powers up in microseconds
• Single-chip, secure solution
• Programmable through JTAG, SPI or I2 C
• Supports background programming of non-volatile memory
• Optional dual boot with external SPI memory
TransFR™ Reconfiguration
• In-field logic update while system operates
Enhanced System Level Support
• On-chip hardened functions: SPI, I2 C, timer/ counter
• On-chip oscillator with 5.5% accuracy
• Unique TraceID for system tracking
• One Time Programmable (OTP) mode
• Single power supply with extended operating range
• IEEE Standard 1149.1 boundary scan
• IEEE 1532 compliant in-system programming
Broad Range of Package Options
• TQFP, WLCSP, ucBGA, csBGA, caBGA, ftBGA, fpBGA, QFN package options
• Small footprint package options
– As small as 2.5 mm x 2.5 mm
• Density migration supported
• Advanced halogen-free packaging
Environmental & Export Classifications of LCMXO2-1200HC-5TG100C
ATTRIBUTE | DESCRIPTION |
RoHS Status | ROHS3 Compliant |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
REACH Status | REACH Unaffected |
ECCN | EAR99 |
HTSUS | 8542.39.0001 |
