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SI7232DN-T1-GE3 2N CH Mosfet Array 20V 25A 23W PPAK 1212-8
Product Details:
| Place of Origin: | original |
| Brand Name: | original |
| Certification: | original |
| Model Number: | SI7232DN-T1-GE3 |
Payment & Shipping Terms:
| Minimum Order Quantity: | 1 |
|---|---|
| Price: | negotiation |
| Packaging Details: | carton box |
| Delivery Time: | 1-3working days |
| Payment Terms: | T/T, L/C |
| Supply Ability: | 100,000 |
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Detail Information |
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| Product Status: | Active | Technology: | MOSFET (Metal Oxide) |
|---|---|---|---|
| Configuration: | 2 N-Channel (Dual) | FET Feature: | Logic Level Gate |
| Drain To Source Voltage (Vdss): | 20V | Current - Continuous Drain (Id) @ 25°C: | 25A |
| Rds On (Max) @ Id, Vgs: | 16.4mOhm @ 10A, 4.5V | Vgs(th) (Max) @ Id: | 1V @ 250µA |
| Highlight: | SI7232DN-T1-GE3,Mosfet Array 20V 25A 23W,20V 25A 23W PPAK |
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Product Description
SI7232DN-T1-GE3 Current Sense Resistors Mosfet 2n-Ch 20v 25a Ppak 1212-8
Mosfet Array 20V 25A 23W Surface Mount PowerPAK® 1212-8 Dual
Specifications of SI7232DN-T1-GE3
| TYPE | DESCRIPTION |
| Category | Discrete Semiconductor Products |
| Transistors | |
| FETs, MOSFETs | |
| FET, MOSFET Arrays | |
| Mfr | Vishay Siliconix |
| Series | TrenchFET® |
| Package | Tape & Reel (TR) |
| Cut Tape (CT) | |
| Digi-Reel® | |
| Product Status | Active |
| Technology | MOSFET (Metal Oxide) |
| Configuration | 2 N-Channel (Dual) |
| FET Feature | Logic Level Gate |
| Drain to Source Voltage (Vdss) | 20V |
| Current - Continuous Drain (Id) @ 25°C | 25A |
| Rds On (Max) @ Id, Vgs | 16.4mOhm @ 10A, 4.5V |
| Vgs(th) (Max) @ Id | 1V @ 250µA |
| Gate Charge (Qg) (Max) @ Vgs | 32nC @ 8V |
| Input Capacitance (Ciss) (Max) @ Vds | 1220pF @ 10V |
| Power - Max | 23W |
| Operating Temperature | -55°C ~ 150°C (TJ) |
| Mounting Type | Surface Mount |
| Package / Case | PowerPAK® 1212-8 Dual |
| Supplier Device Package | PowerPAK® 1212-8 Dual |
| Base Product Number | SI7232 |
Features of SI7232DN-T1-GE3
The PowerPAK 1212-8 package (Figure 1) is a derivative of PowerPAK SO-8. It utilizes the same packaging technology, maximizing the die area. The bottom of the die attach pad is exposed to provide a direct, low resistance thermal path to the substrate the device is mounted on. The PowerPAK 1212-8 thus translates the benefits of the PowerPAK SO-8 into a smaller package, with the same level of thermal performance. (Please refer to application note “PowerPAK SO-8 Mounting and Thermal Considerations.”)
Applications of SI7232DN-T1-GE3
Vishay Siliconix surface-mount packages meet solder reflow reliability requirements. Devices are subjected to solder reflow as a preconditioning test and are then reliability-tested using temperature cycle, bias humidity, HAST, or pressure pot. The solder reflow tempera
Environmental & Export Classifications of SI7232DN-T1-GE3
| ATTRIBUTE | DESCRIPTION |
| RoHS Status | ROHS3 Compliant |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| ECCN | EAR99 |
| HTSUS | 8541.29.0095 |
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